MIT.nano Tool Talks are designed to introduce the latest transformative technologies, tools, methods, and even new sciences that are emerging from research innovations.
Tool Talks are sponsored by individual tool suppliers but geared towards the entire MIT community — applicable to a generalized scientific audience from materials science to electrical engineering, applied physics to biology and medicine, mechanical engineering to environmental science and more — for broadest impact and to provide educational value for all levels of students, postdocs, staff, faculty, and collaborators.
Since September 2017, MIT.nano has hosted over 40 tool talks. See a quick snapshot of all the tool suppliers who have participated below. Read more about these and upcoming tool talks here.
- FEI Thermo Fisher Scientific—Next generation electron microscopy technology and applications
- Carl Zeiss Microscopy—Technical innovations in electron, x-ray, and ion beam microscopy applications for both materials and life sciences
- Raith—Advancing nanoscale science and engineering with EBL, FIB, and SEM nanofabrication
- Ametek—Advanced technologies for analysis and metrology in nanotech, life science, and material science applications
- Protochips, Inc.—Accelerating research with in situ microscopy
- Physical Electronics—Mass spectrometry imaging beyond "show & tell:" 2D & 3D imaging and identification of chemistry by parallel imaging MS/MS
- Hitachi High Technologies America—Nano-Alchemy and the art of observation in SEM, STEM and TEM
- SAMCO—High performance etch and thin film deposition solutions
- Bruker—Next generation instrumentation for nanoscale research using AFM, nanoIR, XRD, XRF, X-ray uCT, EDS, EBSD, NanoIndentation, and fluorescence microscopy
- Neaspec—Advanced optical imaging and spectroscopy with s-SNOM: From nanoscale chemical identification of polymers to real-space visualization of exotic waves in 2d materials
- Nanoscribe—Two-photon polymerization in 3D printing sets new standards in micro and nanofabrication
- JEOL—Advanced applications of microscopy (SEM and TEM), surface analysis, NMR, mass spectrometry, and direct write e-beam lithography
- NION—Aberration-corrected STEM: past, present, and future
- Oxford Instruments—Pushing the boundaries of nanoscale processing, characterization, and analysis
- TESCAN—Advancements in analytical and plasma focused ion beam technologies
- Kurt Lesker—PVD techniques, advanced ALD, and PVD system software and control system designs
- Rigaku—X-ray Vision: An introduction to X-ray computed tomography for life science and materials science research
- Bruker—Latest advances in AFM nanomechanics, nanoindentation and nanoscale infrared spectroscopy technologies
- Thermo Scientific—Multi-technique analysis with the Thermo Scientific NEXSA XPS spectrometer
- Refeyn Ltd—Weighing molecules with light: A new way to study biomolecules
- Leica—Cryo-EM microscopy sample preparation workflow
- LatticeGear—Cleaving technologies to downsizing, singulating, and cross-sectioning substrates
- DISCO—A survey of novel process development and unique technology adaptations in dicing, grinding, and polishing unit operations for advanced packaging
- InVision Technologies—Building and measuring with light: An introduction to advanced DLP projection systems for 3D printing, metrology and lithography
- Arradiance—Atomic layer deposition: Pioneering research with atomic-scale precision
- Semilab—Advancements in electrical and optical characterization technologies
- WITec—3D raman imaging: Instrumentation, resolution, and applications
- Finetch—High accuracy advanced packaging/microelectronics assembly and silicon photonics bonding demo
- Agilent Technologies—Advancement in laser direct infrared chemical imaging and UV-VIS-NIR spectrophotometry
- Dynamic Biosensors—heliX next-generation modular biosensor for interaction and conformation analysis
- Anton Paar—Simplifying atomic force microscopy
- Bruker—LEPTOS software for high-resolution x-ray diffraction (HRXRD) of epitaxial thin films
- Attolight—Cathodoluminescence spectroscopy for advanced semiconductor science
- Rave-Scientific & MEL-BUILD—The challenges of acquiring atomic-scale information at cryogenic temperatures in the transmission electron microscope
- Raith America—VELION—A novel FIB-SEM nanofabrication instrument and its applications in nanoscale science and engineering
- Gatan—Remote advanced Electron Energy Loss Spectroscopy (EELS) workshop
- EDAX—Technological breakthroughs for EBSD: Faster mapping and greater sensitivity
- Alemnis—Recent innovation in Scanning Electron Microscope (SEM) in-situ extreme mechanics at the micro and nanoscale
- CAMECA—Atom probe tomography for atomic scale characterization
- Thermo Fisher Scientific—Enabling atomic resolution Cryogenic Electron Microscopy
- PrimeNano—Advances in Scanning Microwave Impedance Microscopy
- Imina Technologies—Electrical probing and manipulation at the nanoscale
- SPT Labtech—Enabling a paradigm shift in CryoEM sample preparation with chameleon
- DENSsolutions—Advanced in-situ transmission electron microscopy
- UpNano—Pushing resolution and speed limits in 3D printing
- Zeiss—Frontiers in 3D imaging & characterization with X-ray microscopy
- NanoFrazor—Fabricating advanced 2D and 3D structures using thermal scanning probe lithography
- Beneq—Versatile, automated ALD solution for high-throughput semiconductor production
- Zurich Instruments—Electrochemical impedance spectroscopy workshop
- Arradiance—Impact of atomic layer deposition
- Bayflex Solutions—Flexible electronics reliability test
- Nano Dimension—3D printed microelectronics & new design concepts
- ThermoFisher—Automation, AI and machine learning in electron microscopy: current trends and future developments
- WITec—Confocal Raman imaging: Applications and underlying principles
- Stratasys—Additive manufacturing / 3D printing
- Vanguard Automation GmbH—Next generation photonic integration and packaging solutions with photonic wire bonding and facet-attached micro-optical elements
- Vitrotem—Graphene liquid cells and their newest applications in TEM
- KLA—Complete system profilometry: optical, stylus, thin film characterization
- Rigaku—Opportunities and challenges in metrology for emerging technologies
- Thermo Fisher Scientific—Cryo electron microscopy, a powerful technique to study biological systems
- Samco—Profile control for III-V compound semiconductor devices using ICP-RIE etching tools
- 3D-Micromac—Laser-based sample preparation and large volume workflows
- Heidelberg Instruments—Enabling novel devices with the NanoFrazor
- SiruisXT—Seeing cells in 3D: Cryo-soft X-ray tomography in the laboratory
- Oxford Instruments/Asylum Research/WITec—Advanced AFM and Raman
- Zeiss—Advanced imaging modes in field-emission SEMs
- Gatan/EDAX—EDS/EBSD workshop
- In-Situ Microscopy Solutions—Alemnis (micromechanical testing), Imina Technologies (electrical nanoprobing), NenoVision (AFM-in-SEM), point electronic (EM signal acquisition and processing)
- Leica—Label free and confocal imaging with coherent Raman scattering
- Semilab—Spectroscopy ellipsometry workshop
- Kurt J. Lesker—Vacuum science and system design; Physical vapor deposition and thin film growth models