2025 NNCI Etch Symposium

Homepage | Registration | Program | Travel | Sponsorship

The organizing committee of the 2025 NNCI Etch Symposium invites you to submit your research as an opportunity to present a poster. The focus of the symposium is to address the increasing demands on plasma etching placed upon it by aggressive device dimensional scaling, 3D architecture, the integration of new materials, and the challenges of ultra-high aspect ratio patterning. 

If you are speaking at the symposium, and have a question about your abstract, please email nnci-etch@mit.edu

We request that submissions fall within the following topical areas:

1. Device driven plasma etch challenges

• Decreased dimensional scaling
• Ultra-high aspect ratio patterning
• Successful integration of new materials (including 2D materials)
• Electronic, photonic, quantum, and MEMS based devices

2. Advances in atomic scale processing

• Interface preservation-low damage and high selectivity
• Atomic layer etch mechanisms, both plasma and thermal
• Solutions for etching novel materials

3. Advances in Cryogenic Etching

• Ultra-high aspect ratio patterning of dielectrics and metals
• Solutions for low damage and maximized uniformity

4. Plasma characterization, diagnostics, and manipulation

• Discernment of the internal plasma parameters
• Pulsed plasmas to address RIE-lag and high aspect ratio etching

5. Modeling, artificial intelligence, machine learning for plasma etching

• Simulation to correlate external process parameters & internal plasma properties
• ML/AI augmentation for process optimization and control
• AI for shorter development times and desired etch outcomes

6. Sustainability in plasma etching

• Use of lower GWP etch chemistries
• Lower GWP impact on sidewall evolution, profile preservation, and selectivity
• Engineered sustainability solutions

Submission Deadlines

Abstract and poster submission opens April 7, 2025 and closes May 1, 2025

Acceptance will be communicated by May 29, 2025.