The G&P Chemical Mechanical Polishing (CMP) tool has been successfully moved and installed at MIT.nano!
This tool allows for CMP of various thin films on wafers and pieces of specific sizes (requires sample holder). Wafers are manually mounted on appropriate chucks and polished on appropriate pads (chucks and pads are dedicated to green or red processing). You can find this tool listed in Coral as: B12 / Wet / CMP-GnP
Prior to the move, the CMP tool infrastructure was prepared at MIT.nano in early August. The CMP is located in the return air path, with a dedicated wetbench right behind it for post-CMO cleaning. That way, samples don't need to be transported from tool to clean, and after cleaning and immediately re-enter the cleanroom. In mid-August, the tool was successfully relocated from the fifth floor of Building 39.
