September 27, 2021
MIT.nano's new ESI asher was started up this week. It is capable of fast ashing from pieces up to 8” wafers, and has a 25-wafer cassette. Fast-ashing as well as descum are possible. The tool can be found in CORAL under the name "Asher-Chuck-ESI" and is physically located in 6L.
Recipe setup is in progress, and MIT.nano staff expect this tool to be available for wafers in the next week (beginning of October). For pieces, we are awaiting carrier chucks (may take a few more weeks).
This new ESI asher replaces the asher-ICL capabilities. The ICL asher will be shut down by October 15 assuming the ESI is up and running.