Technical Innovations in Electron, X-ray, and Ion Beam Microscopy Applications for both Materials and Life Sciences

Sponsored by Carl Zeiss Microscopy

Wednesday, October 25, 2017
6-104, Chipman Room
182 Memorial Drive (Rear)
Cambridge, MA
10:00am-4:00pm

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Agenda

10:00am–10:30am

Coffee and Registration

10:30am–10:45am

Introduction

10:45am–11:30am

New Opportunities in 3D Analysis with X-ray Microscopy

Dr. Will Harris, Carl Zeiss Microscopy

In this session we'll explore the emerging research applications, along with underlying technology and methodology, stemming from 3D X-ray microscopy (XRM). As a nondestructive characterization method, XRM allows us to uniquely evaluate the internal structures of our samples and specimens at sub-micron resolution, covering multiple contrast mechanisms and length scales. Moreover, 4D investigation of structures via in situ or ex situ repeated imaging provides new opportunities for understanding materials evolution/degradation processes, and correlative workflows linking XRM with other modalities such as EM or FIB-SEM offer the chance to easily span across a range of length scales. Several examples will be presented, with an emphasis on the latest developments and an outlook towards the future.

11:30am–12:00pm

Lunch

12:00pm–12:45pm

Correlative Microscopy in Studying Advanced Coatings

Dr. Sina Shahbazmohamadi, Director of UCONN's Refine Lab

The research questions in advanced coatings research demands a multi-scale investigation which in turn requires a multi-dimensional, multi-instrument, multi-modal characterization. This talk highlights some collaborative efforts between UConn REFINE and key industrial collaborators to address these challenges though utilization of a broad range of imaging modalities including: Optical, 3D X-ray, Electron and Ion Microscopy. In addition, using Correlative Microscopy, information is not only preserved and transferred from one instrument to another but also will inform the next instrument where and how the next step will be performed.

Using image processing and machine learning, we take the understanding one step further through quantification of important parameters such as porosity in 3D, evolution of cracks and microstructure in 4D (In situ through time) among many.

1:00pm–1:45pm

Advances in ion beam technology

Dr. Soeren Eyhusen, Carl Zeiss Microscopy

This presentation will focus on latest application examples and new developments in focused ion beam technology. We will introduce a correlative microscopy workflow that allows you to move your data and sample seamlessly from one instrument to the other, relocate your region of interest and acquire high resolution 3D datasets using innovative auto functions and ion beam milling strategies. We will also explore nanofabrication on length scales beyond what traditional gallium ion beams can achieve and show sub-10nm structures created with helium and neon focused ion beams.

2:00pm–2:45pm

Latest Innovations in ZEISS FE-SEM Technologys

Dr. Pascal Anger, Carl Zeiss Microscopy

The presentation will introduce in the latest ZEISS FE-SEM technologies covering the new GeminiSEM 500 and the MultiSEM 506. The novel optical design of the Gemini column now delivers high contrast images at low voltage combined with excellent signal detection efficiency and signal-to-noise. Furthermore, an innovated concept for imaging at higher pressure ranges allows fast acquisition of crisp images in variable pressure mode with all the Inlens detectors known from high vacuum mode. The recent achievement in correlative microscopy is the full integration of WITec 3D confocal Raman microscope into ZEISS FESEMs. With MultiSEM you unleash the acquisition speed of up to 91 parallel electron beams, which allows to image samples in the centimeter - scale at nanometer resolution.

3:00pm

Closing/remarks

3:00pm–4:00pm

Four informal break-out round table discussions focused on X-Ray Microscopy, Ion Microscopy, Fe-SEM/Xbeam and Multi SEM technologies. These break-out sessions will take place in the same location as the talks.

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