The MRSI Die Bonder is available in MIT.nano's fifth floor packaging space.
Primary uses include in-situ assembly processes such as eutectic die bonding, UV epoxy die attach, and flip chip assembly via machine vision. The tool can achieve automated 3 um pick and place alignment accuracies. Sample sizes from 0.2 mm to 2 cm. Wafer sized substrates can be used during epoxy bonding. Bonding forces are as little as 10 g for delicate III-V semiconductors or as large as 5 kg. Potential bonding environments include Nitrogen, Argon, 95%N25%H2, ArH2. The tool also allows for highly customizable processes including temperature range selection up to 450C.
Ideally suited for (but not limited to) applications such as microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.
Contact Drew Weninger (drewski@mit.edu) for more information.